Machine Tooling
Resin diamond grinding wheel for semiconductor, for sapphire, silicon, resin bond diamond wheel
2017-07-29 18:10  Visit:158
Price:Unfilled
Send inquiry
Model Number: D255-#4537 Brand Name: XINYA Key Specifications/Special Features: Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer
Shipping Information:
  • FOB Port: Shanghai
  • Lead Time: 10 - 15 days
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe
Message

TO: xydiamond

E-mail:

Content:

Contact information
Comment
0