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Resin diamond grinding wheel for semiconductor, for sapphire, silicon, resin bond diamond wheel

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-07-29 18:10

  • Browse the number:

    174

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Company Profile

Zibo Hans International Co. Ltd

By certification [File Integrity]

Contact：xydiamond(Mr.)  

Email：

Telephone：

Area：Beijing

Address：313, 2nd Building, 145, Zhengtong Road, Zhangdian, Zibo, Shandong, China (255086)

Website： http://xydiamond.shanxismy.com/

PRODUCT DETAILS
Model Number: D255-#4537 Brand Name: XINYA Key Specifications/Special Features: Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer
Shipping Information:
  • FOB Port: Shanghai
  • Lead Time: 10 - 15 days
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe

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